3D Glass Solutions (3DGS) provides an ultra-low-loss platform for both Radio Frequency Integrated Circuit (RFIC) and antenna integration (i.e. Antenna-in-Package or AiP). By utilizing 3DGS’ patented air-cavity manufacturing process, millimeter-wave (mmWave) antenna and transmission-line-based structures achieve superior performance compared to conventional packaging technologies.
3DGS and Nokia Bell Labs have partnered to create a novel 64-element air-filled slot antenna array operating from 77 to 81 GHz; however, the technology is scalable for frequencies up to 200 GHz.
3DGS’ manufacturing technology creates an air-filled Substrate Integrative Waveguide (SIW) with an effective Dk ≃ 1.0. Micron-scale precision manufacturing enables ultra-low-loss with high manufacturing repeatability. Preliminary results show excellent return loss and gain across the antenna bandwidth.
Air-Filled Substance Integrative Waveguide
Antenna-in-Package (AiP) Building Blocks Using Air-Filled SIW
- Transmission Lines
- RFIC-to-SIW transitions