3D Glass Solutions, Inc. (3DGS) is a leading manufacturer of high performance, 3D RF passives and photonic devices. Learn how we are transforming design methodologies for high-speed communications and data transfer technologies that enable smaller footprints, higher performance and longer battery life.
RF Discrete Components
High precision RF discrete passive components including inductors, resistors and capacitors with high Q and high SRF for GHz applications.
Integrated Passive Devices
3DGS technology allows RF designs to create high performance IPDs. With 3DGS techniques, integration of 3D inductors, MIM capacitors, thin film resistors, resonator cavities and integrated in-part shielding are possible. 3D-designed IPDs eliminate parasitic crossovers and are very low loss.
Antennas with integrated feed networks and baluns can be created with exceptional gain and high isolation to ground. The ability of 3DGS technology to manufacture precise features and ‘floating’ transmission lines means considerably better performance than PCB or LTCC-based structures.
Precision micro-features enabled by 3DGS technology are capable of being integrated with fiber optics for fiber aligners, delivering hole-to-hole alignment of less than 1.5 µm, even in an array structure. Other photonic components include bridges and submounts.
Thermal solutions include thermal vias with excellent thermal transfer capabilities of over 100 W/m-K. Thermal features can also be used as fully-integrated shielding and grounding solutions for interposers and substrates.
Interposers and Substrates
Glass-based interposers for SiP and AiP as well as photonic modules are made possible by 3DGS-enabled integration of semiconductor devices, SMT components and IPDs directly onto interposers.
Custom Design & Fabrication
With high isolation of signal to signal and signal to ground, high performance custom design and fabrication of countless devices can be achieved.
ALBUQUERQUE, NEW MEXICO — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional (3D) passive RF devices, announced today it has closed $12 million in series B equity funding, bringing the company’s total equity funding to more than $19 million.
ALBUQUERQUE, NEW MEXICO — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive RF devices, announced today that it has secured an investment from aerospace and global security leader Lockheed Martin, as part of its Series B funding.
EL SEGUNDO, Calif. – NI (formerly AWR Corporation) and 3D Glass Solutions (3DGS) will demonstrate a pre-release of the innovative 3DGS glass-based millimeter-wave (mmWave) RF device process design kit (PDK.)