Life MicroFab

IC/MEMS Packaging

Life BioScience Inc (LBSI) is working with the National Science Foundation on a Phase One Grant to deliver a solution for IC Packaging for the next generation of semiconductor and MEMS devices using their APEX™ Glass -Ceramic material. Life MicroFab (LMF), the custom micro-device  fabrication division of LBSI, can work with your design group to deliver packaging interface devices in the APEX™ Glass ceramic material for your specific packaging requirements.

APEX™ Glass ceramic represents a single material capable of being used for optical waveguides, imbedded microfluidics, and ultra-fine printed through-holes.

APEX™ Glass ceramic's In-Package Advantages

Perhaps the most promising aspect of APEX™ Glass ceramic is its potential for the “In-package” design of cooling and optical waveguides. Cooling is currently accomplished by air-cooled heat sinks, but due to projected junction temperatures, the ITRS predicts that air cooling will need to be replaced in a couple of years. Today’s cooling methods rely upon large thermal mass heat sinks. These devices limit the chip packing density, and increase wiring length, which contributes to higher interconnect latency, higher power dissipation, lower bandwidth, and higher interconnect losses . APEX™ Glass ceramic is currently used for the production of microfluidics for biological and chemical reactions and thus provides a ready reference product for in-package microfluidic cooling.

The second key in-package feature unique to APEX™ Glass ceramic is the ability to create microstructures of optically transparent glass surrounded by non-transparent ceramic. These glass waveguides can be produced either vertically or horizontally within multi-layer packages. In the processing of waveguides areas of reduced index of refraction (ceramic) surround areas of increased index of refraction (glass). The intermediate integration of optoelectronic devices onto packaging structures will address the key bottleneck of low-latency, high-bandwidth, and high density off-chip interconnects.

APEX™ Glass ceramic is a “Green Packaging Material"

The IC and packaging industry have been moving towards “green” packaging materials to meet the Reduction of Hazardous Substances directive (RoHS, European Union Directive). One of the biggest concerns has centered around halogen containing substrates, and in particular FR4. FR4 is made with halogen elements and when it catches on fire can produce toxic gasses. APEX™ Glass ceramic is produced with zero halogen containing ingredients. Additionally, because the material is a glass ceramic, it does not need to meet UL94 requirements (which pertains only to plastic materials). While APEX™ Glass ceramic is processed with hydrofluoric acid, only dilute amounts (5%) are used, and etchants solutions may be used for weeks at a time.

To learn more about our capabilities and how they might help you, please visit our OEM Design Rules page where you'll find PDF documents that describe in greater detail our capabilities and how they might help you with a solution for your next generation product.  Contact Life MicroFab today to see how we can help bring your designs to reality.